Things are started getting clear about next iPhone, as we start getting leaks about what inside new iPhones. Earlier leaks images pointing toward iPhone 8 but there are few photos purporting to be of iPhone 7s components. The new images include images of new A11 Chipset which Apple own, we also get a glimpse of the new logic board of new iPhone.
Benjamin Geskin tweeted a logic board photo which is an exact match for separate photos we have seen an earlier model. Apple A11 chipset will have more power than its predecessor as always but this time Apple will push far more than power to run AR content in a smartphone so it must need much more power than an earlier processor. Apple also using new 3D sensing technology for facial recognition so this Chipset must powerful to handle all these tasks include other important stuff.
iPhone 7s will have different specs as compared to iPhone 8 model as both devices will get A11 Chipset but other stuff like RAM will be different because iPhone 8 has much more feature than iPhone 7s and 7s Plus.
iPhone 7s will feature little upgrade over iPhone 7 with a new processor, all new glass body design, slightly thicker model and other little feature made the great difference between iPhone 7 and 7s. While iPhone 8 will have much more feature like AR and FaceID which already create much rumor earlier this month.
We still know much less about iPhone 7s like which feature will differ between iPhone 7 and iPhone 7s, as this will become main selling point between iPhone 7 and iPhone 7s. So hope Apple will come somethings amazing with iPhone7s.
